Regardless of an engineer’s experience level, a practically unlimited number of variables creates challenges to overcome while designing a printed circuit board assembly. During the design phase engineers have to work across functional groups to understand the product and regulatory needs. Both are dependent upon product success and market acceptance and both add challenges for the engineer.

Important Notes:
  • Follow IPC standards.
  • Max arrays are 14” x 14” (larger sizes can be used but require additional tooling and fixturing).
  • Double-sided PCBAs with mixed technology should place larger/heavier components on the top side of the board. The weight of the components could have an adverse effect during the reflow process if they are mounted on the bottom.
  • Avoid placing BGAs on the bottom side of a board whenever possible.
    If need be, never mount BGAs over each other, you will not be able to inspect solder connections with x-ray technology.
  • Try to place thru-hole components on one side of the board to avoid inefficient thru-hole soldering operations.
  • ICs and passive components with uniform orientation will enhance machine placement and inspection efficiences.
  • For RoHS PCB
    • Higher-Quality Finish—Immersion Gold plating
    • Lower-Quality Finish—Lead-Free HASL
  • If boards are panelized, v-scores are best for depaneling.
    • If you use breakaway tabs (i.e. mouse-bites) use 0.508mm (0.020”) drill holes.
    • When a board is panelized use 6.35mm (0.25”) rails on all four sides with 3.175mm (0.125”) mounting holes and 1.27mm (0.050”) fiducials in each corner.
  • To improve quality and manufacturing processes, a thorough test plan should be developed and implemented prior to production.

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